You can download PICLS related resources from below.

Interview with our Developer (Development of PICLS)

PICLS is a computational thermal analysis tool designed for PCB (printed circuit board) design engineers, who may have little experience with numerical analyses. Intended for simple and quick execution of thermal analyses, PICLS uses an intuitive two-dimensional interface that combines the Preprocessor for controlling analysis model settings and Postprocessor for displaying results into one. The goal was “to create greater benefit for PCB design engineers by allowing them to evaluate thermal design ideas easily on the spot.” Jun Eto from the Cradle Software Engineering Department provides a detailed account of the development.

Case Study Interview (Hitachi Mito Engineering Co., Ltd.)

- Real-time Solutions for Thermal Problems
- Key to Success is a Workplace Environment Where Design Engineers Can Promptly Implement Their Ideas

Hitachi Mito Engineering provides engineering support for the development of elevators and various industrial products. To minimize tasks and improve process efficiency during the early phases of development, they conduct simulations for thermal design processes using analysis tools developed by Software Cradle. Hitachi Mito Engineering has been a very successful company. This narrated interview will provide insight about how they achieve steady growth while incorporating the latest technology and consistently building on their accumulated experiences.



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