Thermal countermeasures using PICLS

Useful applications of PICLS

・Troubleshooting thermal issues of current products
・Examining thermal interferences of part layouts
・Consider heat release changes depending on a wiring pattern (coverage ratio)
・Examine the arrangement of thermal vias (e.g. location, number)
・Examine the performance of a heat sink
・Examine the size of a PCB
・Examine the number of layers and the thickness of copper foil
・Consider natural/forced air cooling
・Consider radiant heat
・Considering heatsinks (number of fins, size
・Examining heat dissipation performances by connection to enclosure
・Considering PCB mounting environment

Main functions of PICLS

Modelling

External file interface

・You can import IDF 3.0 and Gerber data

Consideration of simple enclosure
・You can consider heat dissipation by connection to enclosure

Heatsink

・You can allocate and display parts such as plate fins and heat dissipation plates

Library

・You can register and reuse created parts to the library

Cutting out a PCB
Create a PCB of arbitrary shape by cutting out

Preview
Check the layout of components in 3D

Setting wiring pattern coverage ratio
Specify the area by rectangle and polygon

Placing thermal vias
Specify through hole and IVH
Specify filled via

Setting mounting environment
Mount horizontally/vertically
Consider forced air cooling and radiation

Displaying each layer
Check each layer by selecting a focused layer

Calculation and result display

Real-time display
Check component translation in real time

Report output
Output analysis results as reports

Alert function
・You can check parts whose temperature
is higher than threshold

Linking with thermo-fluid analysis
Output CAB file for scSTREAM or HeatDesigner

Contact

Contact us for any inquiry on PICLS using the form below.

Or, send emails to the following address.
Email: picls@cradle.co.jp